Jongmyung Kim,: search on Z-Library

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1

Ultrasound-induced equiaxial flower-like CuZn5/Al composite microstructure formation in Al/Zn–Al/Cu joint

Xiao, Yong, Ji, Hongjun, Li, Mingyu, Kim, Jongmyung

Journal:

Materials Science and Engineering: A

Year:

2014

Language:

english

File:

PDF, 1.42 MB

english, 2014

2

Evidence for light-induced oxygen exchange in the oxidation of liquid hydrocarbons on oxygen 18-labelled titanium dioxide

Choi, Jongmyung, Kang, Donghyeon, Lee, Kyu Hyung, Lee, Byeongno, Kim, Kyung Joong, Hur, Nam Hwi

Journal:

Year:

2013

Language:

english

File:

PDF, 584 KB

english, 2013

3

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging

Wang, Shuai, Li, Mingyu, Kim, Jongmyung

Year:

2014

Language:

english

File:

PDF, 667 KB

english, 2014

4

Local melt process of solder bumping by induction heating reflow

Xu, Hongbo, Li, Mingyu, Fu, Yonggao, Wang, Ling, Kim, Jongmyung

Journal:

Soldering & Surface Mount Technology

Year:

2009

Language:

english

File:

PDF, 525 KB

english, 2009

5

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging

Wang, Shuai, Li, Mingyu, Kim, Jongmyung

Year:

2014

Language:

english

File:

PDF, 667 KB

english, 2014

6

Geometry control of solder interconnects via induction heating

Xu, Hongbo, Li, Mingyu, Fu, Yonggao, Wang, Ling, Kim, Jongmyung

Journal:

Soldering & Surface Mount Technology

Year:

2009

Language:

english

File:

PDF, 422 KB

english, 2009

7

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Lead-Free Soldering Technique by Using Medium-Frequency Electromagnetic Field

Xu, Hongbo, Li, Mingyu, Kim, Jongmyung, Kim, Daewon

Year:

2008

Language:

english

File:

PDF, 4.40 MB

english, 2008

8

3D Stackable and Scalable Binary Ovonic Threshold Switch Devices with Excellent Thermal Stability and Low Leakage Current for High‐Density Cross‐Point Memory Applications

Yoo, Jongmyung, Kim, Seong Hun, Chekol, Solomon Amsalu, Park, Jaehyuk, Sung, Changhyuck, Song, Jeonghwan, Lee, Donghwa, Hwang, Hyunsang

Journal:

Advanced Electronic Materials

Year:

2019

Language:

english

File:

PDF, 2.23 MB

english, 2019

9

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Pressureless low temperature sintering of Ag nanoparticles for interconnects

Shuai Wang,, Hongjun Ji,, Mingyu Li,, Jongmyung Kim,, Hongbae Kim,

Year:

2012

Language:

english

File:

PDF, 505 KB

english, 2012

10

Solid-state interfacial reaction of eutectic Sn3.5Ag and pure tin solders with polycrystalline Cu substrate

Yang, Ming, Chen, Hongtao, Ma, Xin, Li, Mingyu, Cao, Yong, Kim, Jongmyung

Journal:

Journal of Materials Science

Year:

2014

Language:

english

File:

PDF, 3.82 MB

english, 2014

11

Eddy Current Induced Heating for the Solder Reflow of Area Array Packages

Li, Mingyu, Xu, Hongbo, Lee, Shi-Wei Ricky, Kim, Jongmyung, Kim, Daewon

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 970 KB

english, 2008

12

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Local Melting and Formation Steps of Solder Bumps via Induction Heating Reflow

Xu, Hongbo, Li, Mingyu, Cheng, Gang, Kim, Jongmyung, Kim, Daewon

Year:

2007

Language:

english

File:

PDF, 1.59 MB

english, 2007

13

PD03-08 PATHOLOGICAL OUTCOME FOLLOWING RADICAL PROSTATECTOMY IN MEN WITH PSA GREATER THAN 10 AND HISTOLOGICALLY FAVORABLE-RISK PROSTATE CANCER

Kwon, Young Suk, Yu, Jiwoong, Kim, Sinae, Han, Christopher, Farber, Nicholas, Kim, Jongmyung, Byun, Seok Soo, Kim, Wun-Jae, Jeon, Seong Soo, Kim, Isaac

Journal:

The Journal of Urology

Year:

2016

Language:

english

File:

PDF, 263 KB

english, 2016

14

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Growth behavior of prismatic Cu6Sn5 and its effect on mechanical properties of eutectic Sn-Ag solder joints

Yang, Ming, Li, Mingyu, Kim, Jongmyung, Kim, Hongbae

Year:

2011

Language:

english

File:

PDF, 2.48 MB

english, 2011

15

A Smart Service Robot Middleware on Ubiquitous Network Environments

Choi, Jongsun, Choi, Jaeyoung, Ko, Hoon, Bae, Kitae, An, Kyung Jin, Kim, Choong Sik, Choi, Jongmyung

Journal:

Intelligent Automation & Soft Computing

Year:

2014

Language:

english

File:

PDF, 540 KB

english, 2014

16

SCDT-23. VISUALIZATION OF BRAIN TUMOR BY NEAR-INFRARED FLUORESCENCE IMAGING VIA TUMOR-TARGETING NOVEL PEPTIDE IDENTIFIED BY PHAGE DISPLAY

Kim, Jongmyung, Huang, Ping, Rich, Jeremy, Liu, James

Journal:

Year:

2017

Language:

english

File:

PDF, 50 KB

english, 2017

17

Titanium oxynitride microspheres with the rock-salt structure for visible-light photocatalysts

Yoo, Jung Bo, Yoo, Hyo Jin, Jung, Hyuk Jun, Bang, Sora, Kim, Han Sol, Choi, Jongmyung, Suh, Hoyoung, Lee, Ji-Hyun, Kim, Jin-Gyu, Hur, Nam

Journal:

Journal of Materials Chemistry A

Year:

2015

Language:

english

File:

PDF, 1.50 MB

english, 2015

18

Comparison of seven indicator PCBs and three coplanar PCBs in beef, pork, and chicken fat

MeeKyung Kim, Sooyeon Kim, Seonjong Yun, Myoungheon Lee, Byunghoon Cho, Jongmyung Park, Seongwan Son, Okkyung Kim

Journal:

Year:

2004

Language:

english

File:

PDF, 249 KB

english, 2004

19

Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging

Ming Yang, Mingyu Li, Jongmyung Kim

Journal:

Year:

2012

Language:

english

File:

PDF, 1.74 MB

english, 2012

20

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Nanoindentation characteristics of Cu6Sn5 formed in lead free solder joints

Zhihao Zhang,, Jongmyung Kim,, Mingyu Li,

Year:

2010

Language:

english

File:

PDF, 1.63 MB

english, 2010

21

BSCI-15. METASTATIC BRAIN TUMOR TARGETING PEPTIDES ISOLATED THROUGH PHAGE DISPLAY BIOPANNING AGAINST BRAIN METASTASIS-INITIATING CELLS

Kim, JongMyung, Liu, James

Journal:

Neuro-Oncology Advances

Year:

2019

File:

PDF, 76 KB

2019

22

[IEEE 2008 8th International Symposium on Antennas, Propagation and EM Theory - Kunming, China (2008.11.2-2008.11.5)] 2008 8th International Symposium on Antennas, Propagation and EM Theory - Dual-feed circular polarization folded microstrip antenna

Yongbo Sim,, Jihae Kim,, Jongmyung Woo,

Year:

2008

File:

PDF, 4.35 MB

2008

23

[IEEE 2013 IEEE International Conference on Mechatronics and Automation (ICMA) - Takamatsu, Kagawa, Japan (2013.08.4-2013.08.7)] 2013 IEEE International Conference on Mechatronics and Automation - Development of multi head review system using the planar stage

Lee, Seokho, Lee, Hansung, Kim, Jongmyung, Kim, Beomsu, Jung, Soohwa

Year:

2013

Language:

english

File:

PDF, 952 KB

english, 2013

24

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Localized heating and bond formation at solder/Cu interface induced by ultrasonic friction

Zhuolin Li,, Mingyu Li,, Kim, Jongmyung, Hongbae Kim,

Year:

2012

Language:

english

File:

PDF, 756 KB

english, 2012

25

STEM-23. METASTATIC BRAIN TUMOR IMAGING THROUGH TARGETED PEPTIDES ISOLATED VIA PHAGE DISPLAY BIOPANNING AGAINST BRAIN METASTASIS-INITIATING CELLS

Kim, JongMyung, Liu, James

Journal:

Year:

2019

File:

PDF, 91 KB

2019

26

Pathological Outcome Following Radical Prostatectomy in Men with PSA Greater than 10 and Histologically Favorable-Risk Prostate Cancer

Yu, Jiwoong, Kwon, Young Suk, Kim, Sinae, Han, Christopher Sejong, Farber, Nicholas, Kim, Jongmyung, Byun, Seok Soo, Kim, Wun-Jae, Jeon, Seong Soo, Kim, Isaac Yi

Journal:

The Journal of Urology

Year:

2015

Language:

english

File:

PDF, 652 KB

english, 2015

27

Local melting and shape controlling of solder joint via induction heating

Hongbo Xu, Mingyu Li, Jongmyung Kim, Daewon Kim

Journal:

Journal of Materials Processing Technology

Year:

2009

Language:

english

File:

PDF, 1.16 MB

english, 2009

28

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Thermal Characters Analysis of Induction-Self-Heating-Reflow for Solders Bumping

Xu, Hongbo, Li, Mingyu, Kim, Jongmyung, Kim, Hongbae

Year:

2006

Language:

english

File:

PDF, 4.95 MB

english, 2006

29

Deep crystallization induced high thermal conductivity of low-temperature sintered Ag nanoparticles

Ji, Hongjun, Wang, Shuai, Li, Mingyu, Kim, Jongmyung

Journal:

Materials Letters

Year:

2014

Language:

english

File:

PDF, 1.30 MB

english, 2014

30

The Power of the Buddhas: The Politics of Buddhism During the Koryǒ Dynasty – By Sem Vermeersch

Journal:

Religious Studies Review

Year:

2010

Language:

english

File:

PDF, 73 KB

english, 2010

31

[IEEE 2010 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM) - Montreal, QC, Canada (2010.07.6-2010.07.9)] 2010 IEEE/ASME International Conference on Advanced Intelligent Mechatronics - Vision-based path planning for the rotation control of unicycle robot

Hwang, Jongmyung, Kim, Sungha, Lee, Jangmyung

Year:

2010

Language:

english

File:

PDF, 584 KB

english, 2010

32

Similarity recognition using context-based pattern for cyber-society

Ko, Hoon, Bae, Kitae, Choi, Jongsun, Kim, Sang Heon, Choi, Jongmyung

Journal:

Soft Computing - A Fusion of Foundations, Methodologies and Applications

Year:

2016

Language:

english

File:

PDF, 2.08 MB

english, 2016

33

Characteristics of mine ventilation air flow using both blowing and exhaust ducts at the mining face

Yi, Huiuk, Park, Jongmyung, Kim, Min Sik

Journal:

Journal of Mechanical Science and Technology

Year:

2020

Language:

english

File:

PDF, 1.68 MB

english, 2020

34

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Nanoscale analysis of ultrasonic wedge bond interface by using high-resolution transmission electron microscopy

Hongjun Ji,, Mingyu Li,, Chunqing Wang,, Jongmyung Kim,, Daewon Kim,

Year:

2008

Language:

english

File:

PDF, 393 KB

english, 2008

35

MP37-08 MISATTRIBUTION ERRORS IN UROLOGIC PROCEDURES FROM THE PROPUBLICA SURGEON SCORECARD

Kwon, Young Suk, Kang, Seonghyun, Wang, Wei, Farber, Nicholas, Radadia, Kushan, Lee, Paul, Kim, Jongmyung, Hong, Jeong Hee, Kim, Isaac

Journal:

The Journal of Urology

Year:

2016

Language:

english

File:

PDF, 367 KB

english, 2016

36

Physical and Functional Differences in Youth Baseball Players With and Without Throwing-Related Pain

Greenberg, Elliot M., Lawrence, J. Todd R., Fernandez-Fernandez, Alicia, Shah, Kshamata, McKenna, Casey, Rowan, Marcus L., Kim, JongMyung, McClure, Phillip

Journal:

Orthopaedic Journal of Sports Medicine

Year:

2017

Language:

english

File:

PDF, 248 KB

english, 2017

37

Analysis of lung cancer morbidity and mortality based on particle swarm optimization

Li, Naiwei, Cheng, Ziyi, Woo, Youngmin, Ha, Jongmyung, Kim, Andre

Journal:

Journal of Physics Conference Series

Year:

2020

File:

PDF, 1.26 MB

2020

38

Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface

Ming Yang, Mingyu Li, Ling Wang, Yonggao Fu, Jongmyung Kim, Lvqian Weng

Journal:

Materials Letters

Year:

2011

Language:

english

File:

PDF, 1.04 MB

english, 2011

39

Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal

Xiao, Yong, Ji, Hongjun, Li, Mingyu, Kim, Jongmyung

Journal:

Materials & Design

Year:

2013

Language:

english

File:

PDF, 2.46 MB

english, 2013

40

Energy Management Optimization of Series Hybrid Electric Bus Using an Ultra-Capacitor and Novel Efficiency Improvement Factors

Hwang, Giyeon, Lee, Kyungmin, Kim, Jongmyung, Lee, Kyu-Jin, Lee, Sangyul, Kim, Minjae

Journal:

Year:

2020

File:

PDF, 5.16 MB

2020

41

Cu6Sn5Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints

Ming Yang, Mingyu Li, Ling Wang, Yonggao Fu, Jongmyung Kim, Lvqian Weng

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 1.62 MB

english, 2011

42

Textured growth of Cu6Sn5 grains formed at a Sn3.5Ag/Cu interface

Mingyu Li, Ming Yang, Jongmyung Kim

Journal:

Materials Letters

Year:

2012

Language:

english

File:

PDF, 749 KB

english, 2012

43

The State and Eminent Monks in Medieval Korea

Journal:

Fudan Journal of the Humanities and Social Sciences

Year:

2014

Language:

english

File:

PDF, 306 KB

english, 2014

44

Additional hardening in harmonic structured materials by strain partitioning and back stress

Park, Hyung Keun, Ameyama, Kei, Yoo, Jongmyung, Hwang, Hyunsang, Kim, Hyoung Seop

Journal:

Materials Research Letters

Year:

2018

Language:

english

File:

PDF, 2.96 MB

english, 2018

45

STEM-03. NOVEL METASTATIC BRAIN TUMOR TARGETS ISOLATED THROUGH PHAGE DISPLAY BIOPANNING AGAINST BRAIN METASTASIS-INITIATING CELLS

Kim, Jongmyung, Bao, Shideng, N. Rich, Jeremy, Liu, James

Journal:

Year:

2018

Language:

english

File:

PDF, 81 KB

english, 2018

46

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Manufacture of hourglass-shaped solder joint by induction heating reflow

Hongbo Xu,, Mingyu Li,, Liqing Zhang,, Jongmyung Kim,, Hongbae Kim,

Year:

2008

Language:

english

File:

PDF, 996 KB

english, 2008

47

Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn–Al hypereutectic filler metal

Xiao, Yong, Ji, Hongjun, Li, Mingyu, Kim, Jongmyung, Kim, Hongbae

Journal:

Materials & Design

Year:

2013

Language:

english

File:

PDF, 1.54 MB

english, 2013

48

[IEEE 2008 IEEE International Symposium on Parallel and Distributed Processing with Applications (ISPA) - Sydney, Australia (2008.12.10-2008.12.12)] 2008 IEEE International Symposium on Parallel and Distributed Processing with Applications - Intelligent Service Enabler Based on Context-Aware in Next Generation Networks

Kim, Jiho, Jeong, Jongmyung, Nam, SeungMin, Song, Ohyoung

Year:

2008

Language:

english

File:

PDF, 675 KB

english, 2008

49

WNT5A induces castration-resistant prostate cancer via CCL2 and tumour-infiltrating macrophages

Lee, Geun Taek, Kwon, Seok Joo, Kim, Jongmyung, Kwon, Young Suk, Lee, Nara, Hong, Jeong Hee, Jamieson, Christina, Kim, Wun-Jae, Kim, Isaac Yi

Journal:

British Journal of Cancer

Year:

2018

Language:

english

File:

PDF, 1017 KB

english, 2018

50

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Ultrasound-assisted brazing of large area Cu/Al dissimilar metals used for package heat dissipation substrate

Xiao, Yong, Li, Mingyu, Kim, Jongmyung

Year:

2013

Language:

english

File:

PDF, 4.16 MB

english, 2013

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